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Thermal Stresses: Design, Behavior & Applications
Alfred R. Webb (Ed.)
€ 239.12
€ 175.14
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Description for Thermal Stresses: Design, Behavior & Applications
Hardback. Editor(s): Webb, Alfred R. Num Pages: 230 pages. BIC Classification: PHH; TGM. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 160 x 231 x 19. Weight in Grams: 460.
Thermal stresses which originate as a consequence of different thermal expansion coefficients of components of multi-component materials represent an important phenomenon in multi-component materials. These stresses are usually investigated by computational and experimental methods are still of interest to materials scientists and engineers. In this book, the design, behavior and applications of thermal stresses are discussed. Chapter One introduces a...
Read moreProduct Details
Format
Hardback
Publication date
2016
Publisher
Nova Science Publishers Inc
Condition
New
Number of Pages
230
Place of Publication
New York, United States
ISBN
9781634853736
SKU
V9781634853736
Shipping Time
Usually ships in 5 to 9 working days
Ref
99-2
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