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Advances in Modeling and Design of Adhesively Bonded Systems
S. Kumar (Ed.)
€ 214.44
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Description for Advances in Modeling and Design of Adhesively Bonded Systems
Hardcover. The book comprehensively charts a way for industry to employ adhesively bonded joints to make systems more efficient and cost-effective Adhesively bonded systems have found applications in a wide spectrum of industries (e.g. , aerospace, electronics, construction, ship building, biomedical, etc. ) for a variety of purposes. Editor(s): Kumar, S.; Mittal, K. L. Series: Adhesion and Adhesives: Fundamental and Applied Aspects. Num Pages: 280 pages, illustrations (black and white). BIC Classification: TGM. Category: (P) Professional & Vocational. Dimension: 241 x 155 x 19. Weight in Grams: 508.
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The book comprehensively charts a way for industry to employ adhesively bonded joints to make systems more efficient and cost-effective
Adhesively bonded systems have found applications in a wide spectrum of industries (e.g., aerospace, electronics, construction, ship building, biomedical, etc.) for a variety of purposes. Emerging adhesive materials with improved mechanical properties have allowed adhesion strength approaching that...
Product Details
Format
Hardback
Publication date
2013
Publisher
John Wiley & Sons Inc United States
Number of pages
280
Condition
New
Series
Adhesion and Adhesives: Fundamental and Applied Aspects
Number of Pages
280
Place of Publication
, United States
ISBN
9781118686379
SKU
V9781118686379
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
About S. Kumar (Ed.)
S. Kumar is ?currently a faculty member at the ?Masdar Institute of Science and Technology, Abu Dhabi, UAE. He obtained his PhD in Solid Mechanics and Materials Engineering from the University of Oxford and an M. Phil from the University of Southampton. He has won?several awards including EPSRC Award at Oxford and a Rolls-Royce/DTI Fellowship at Southampton. He is a...
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