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Michael Pecht - Integrated Circuit, Hybrid and Multichip Module Package Design - 9780471594468 - V9780471594468
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Integrated Circuit, Hybrid and Multichip Module Package Design

€ 211.67
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Description for Integrated Circuit, Hybrid and Multichip Module Package Design Hardcover. Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840.
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.

Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:
* Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost
* Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data ... Read more

Product Details

Format
Hardback
Publication date
1994
Publisher
John Wiley and Sons Ltd United States
Number of pages
464
Condition
New
Number of Pages
464
Place of Publication
, United States
ISBN
9780471594468
SKU
V9780471594468
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-50

About Michael Pecht
DR. MICHAEL PECHT is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an ... Read more

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