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Microlithography: Science and Technology
Bruce W. Smith
€ 237.73
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Description for Microlithography: Science and Technology
hardcover. This edition provides a balanced treatment of theoretical and operational considerations, from elementary concepts to advanced aspects of modern submicron microlithography. Each chapter reflects the current research and practices from the world's leading academic and industrial laboratories detailed by a stellar panel of international experts. Num Pages: 900 pages. BIC Classification: TJFC. Category: (G) General (US: Trade). .
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The completely revised Third Edition to the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from fundamental principles to advanced topics of nanoscale lithography. The book is divided into chapters covering all important aspects related to the imaging, materials, and processes that have been necessary to drive semiconductor lithography toward nanometer-scale generations....
Product Details
Format
Hardback
Publication date
2020
Publisher
CRC Press United States
Number of pages
900
Condition
New
Number of Pages
838
Place of Publication
Bosa Roca, United States
ISBN
9781439876756
SKU
V9781439876756
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-2
About Bruce W. Smith
Bruce W. Smith is a Distinguished Professor of engineering at the Rochester Institute of Technology. He has been involved in teaching and research in microelectronic and microsystems engineering for over 35 years. His areas of research include semiconductor processing, deep ultraviolet (DUV), vacuum ultraviolet (VUV), immersion, and extreme ultraviolet (EUV) lithography, thin films, optics, and microelectronic materials. He has authored...
Read moreReviews for Microlithography: Science and Technology
About the first edition… "…The editors have done an excellent job of gathering the knowledge of a number of world experts and blending it into a harmonious whole which will serve as a reference for some time to come, even in this fast-moving field." -International Journal of Electrical Engineering Education