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Specc
Gajski, Daniel D.; Zhu, Jianwen; Domer, Rainer; Gerstlauer, Andreas; Zhao, Shuqing
€ 186.26
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Description for Specc
Paperback. Num Pages: 313 pages, biography. BIC Classification: TDC; UGC; WM. Category: (G) General (US: Trade). Dimension: 235 x 155 x 17. Weight in Grams: 516.
For the near future, the recent predictions and roadmaps of silicon semiconductor technology all agree that the number of transistors on a chip will keep growing exponentially according to Moore's Law, pushing technology towards the system-on-a-chip (SOC) era. However, we are increasingly experiencing a productivity gap where the chip complexity that can be handled by current design teams falls short of the possibilities offered by technological advances. Together with growing time-to-market pressures, this drives the need for innovative measures to increase design productivity by orders of magnitude.
It ... Read more
For the near future, the recent predictions and roadmaps of silicon semiconductor technology all agree that the number of transistors on a chip will keep growing exponentially according to Moore's Law, pushing technology towards the system-on-a-chip (SOC) era. However, we are increasingly experiencing a productivity gap where the chip complexity that can be handled by current design teams falls short of the possibilities offered by technological advances. Together with growing time-to-market pressures, this drives the need for innovative measures to increase design productivity by orders of magnitude.
It ... Read more
Product Details
Format
Paperback
Publication date
2000
Publisher
Springer-Verlag New York Inc. United States
Number of pages
313
Condition
New
Number of Pages
313
Place of Publication
New York, NY, United States
ISBN
9781461370369
SKU
V9781461370369
Shipping Time
Usually ships in 15 to 20 working days
Ref
99-15
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