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Ceramic Nanomaterials and Nanotechnology III
Lu
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Description for Ceramic Nanomaterials and Nanotechnology III
Paperback. This volume contains papers on the synthesis and processing of inorgainc nanomaterials and nanocomposites; structure-property correlations at the nanoscale; understanding of fundamental phenomena in nanoscale systems and processes; applications of nanostructured materials; and industrial development of nanomaterials. Editor(s): Lu, Song Wei; Hu, Michael Z.; Gogotsi, Yury G. Series: Ceramic Transactions. Num Pages: 284 pages, Illustrations. BIC Classification: TDCQ. Category: (P) Professional & Vocational. Dimension: 225 x 185 x 16. Weight in Grams: 406.
This volume contains papers on the synthesis and processing of inorgainc nanomaterials and nanocomposites; structure-property correlations at the nanoscale; understanding of fundamental phenomena in nanoscale systems and processes; applications of nanostructured materials; and industrial development of nanomaterials.
This volume contains papers on the synthesis and processing of inorgainc nanomaterials and nanocomposites; structure-property correlations at the nanoscale; understanding of fundamental phenomena in nanoscale systems and processes; applications of nanostructured materials; and industrial development of nanomaterials.
Product Details
Format
Paperback
Publication date
2005
Publisher
American Ceramic Society United States
Number of pages
284
Condition
New
Series
Ceramic Transactions
Number of Pages
296
Place of Publication
, United States
ISBN
9781574981803
SKU
V9781574981803
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-50
About Lu
Song Wei Lu is the editor of Ceramic Nanomaterials and Nanotechnology III: Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004, published by Wiley. Michael Z. Hu is the editor of Ceramic Nanomaterials and Nanotechnology III: Proceedings of the 106th Annual Meeting of The American Ceramic Society, Indianapolis, Indiana, USA 2004, published ... Read more
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