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LCP for Microwave Packages and Modules
Anh-Vu H. Pham
€ 102.55
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Description for LCP for Microwave Packages and Modules
hardcover. A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels. Series: The Cambridge RF and Microwave Engineering Series. Num Pages: 266 pages, 227 b/w illus. 24 tables. BIC Classification: TJFC. Category: (U) Tertiary Education (US: College). Dimension: 248 x 179 x 17. Weight in Grams: 68. Series: Cambridge RF and Microwave Engineering Series. 266 pages, 227 b/w illus. 24 tables. A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels. Cateogry: (U) Tertiary Education (US: College). BIC Classification: TJFC. Dimension: 248 x 179 x 17. Weight: 684.
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power ... Read more
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power ... Read more
Product Details
Format
Hardback
Publication date
2012
Publisher
Cambridge University Press
Number of pages
266
Condition
New
Series
The Cambridge RF and Microwave Engineering Series
Number of Pages
266
Place of Publication
Cambridge, United Kingdom
ISBN
9781107003781
SKU
V9781107003781
Shipping Time
Usually ships in 7 to 11 working days
Ref
99-16
About Anh-Vu H. Pham
Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for ... Read more
Reviews for LCP for Microwave Packages and Modules
'These foremost experts have created a compendium on microwave and millimeter-wave applications of LCP in packaging and modules that is clear and comprehensive, starting with materials science and theory, going through wide-ranging and current practical applications, and even covering all of the practical reliability aspects. Moreover, they have revealed in detail a host of design tricks (such as defected grounds) ... Read more